Capability

Innovation at tei Solutions is made possible by providing customers with leading-edge technology and expertise. Customers enjoy a distinct advantage for R&D services — saving crucial time and expediting time to market for new products.

Toolset Capability

100mm Features 150mm Features 200mm Features 300mm Features
Aluminum BEOL
E-Beam Lithography
Alternative Substrates
High-K gate dielectric
(HfO, TiO2, Alumina)
Metal gate (TiN, W)
0.5um Base line
Aluminum BEOL
i-Line Stepperh
180nm Base line
Aluminum BEOL
KrF Stepper
i-Line Stepper
SiGe Epi
In-situ Doped Poly Si
High aspect ratio Si Hole
Deep Si Etch
65nm CMOS Baseline
Poly Si/SiON Gate Stack
Three Layer Cu & Low-K
Immersion Lithography
ELK
High-K Metal Gate