tei Solutions has added new 300mm Patterned Test Wafers:
- Si L/S Etch – Line=50nm, Depth=1000nm
- Si Hole Etch – φ120nm, Depth=1200nm
- SiO L/S Etch – Space=120nm, Depth=2700nm
- Nano gap electrode and micro fluid
To receive further information or to request a quotation, please click here.