Capability
Innovation at tei Solutions is made possible by providing customers with leading-edge technology and expertise. Customers enjoy a distinct advantage for R&D services — saving crucial time and expediting time to market for new products.
Toolset Capability
| 100mm Features | 150mm Features | 200mm Features | 300mm Features |
|---|---|---|---|
| Aluminum BEOL E-Beam Lithography Alternative Substrates High-K gate dielectric (HfO, TiO2, Alumina) Metal gate (TiN, W) |
0.5um Base line Aluminum BEOL i-Line Stepperh |
180nm Base line Aluminum BEOL KrF Stepper i-Line Stepper SiGe Epi In-situ Doped Poly Si High aspect ratio Si Hole Deep Si Etch |
65nm CMOS Baseline Poly Si/SiON Gate Stack Three Layer Cu & Low-K Immersion Lithography ELK High-K Metal Gate |