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9月, 7, 2025
We will be exhibiting at the IEEE/EDS sponsored international conference, DTDA, to be held in Sendai, Japan, from October 20–22, 2025.
Conference Name: IEEE DTDA (Device Technologies for Diversified Applications) 2025 Dates: October 20 (Mon) – 22 (Wed), 2025 Venue: TKP Garden City Premium, Sendai West Exhibition H...
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9月, 7, 2025
IEEE/EDS Sponsored International Conference on Device Technologies for Diversified Applications (DTDA), October 20–22, 2025
It is our honor to announce that our CEO, Shuji Ikeda, will serve as the General Chair of the IEEE/EDS sponsored international conference, DTDA (Device Technologies for Diversified...
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9月, 7, 2025
TMAH & BHF Wet Etching Contract Services
We provide contract wet etching services with TMAH and BHF for Si wafers ranging from 4-inch to 12-inch. The Si etch rate with TMAH wet etching is approximately 20 μm/hour, with wi...
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2月, 28, 2025
We are selling nanopore patterned wafers.
We have nanopore chips (pore diameter 50nm to 10μm) suitable for measuring viruses and proteins.
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2月, 7, 2020
We participate 4th EDTM 2020 !
We will be exhibiting during 4th EDTM 2020 (Electron Devices Technology and Manufacturing Conference) at Hotel Equatorial Penang, Malaysia from 3/16-18, 2020.
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11月, 8, 2018
Winning the 2018 EDS Distinguished Service Award
CEO Dr. Shu Ikeda received the IEEE/EDS Distinguished Service Award 2018. EDS Award 2018
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6月, 14, 2016
New patterned wafer available.
New patterned wafer available. Si Pillar Pattern
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6月, 14, 2016
tei Solutions to exhibit at IEEE NANO 2016 16th INTERNATIONAL CONFERENCE ON NANOTECHNOLOGY
tei Solutions will be exhibiting during IEEE NANO 2016 16th INTERNATIONAL CONFERENCE ON NANOTECHNOLOGY at Sendai International Center, August 22 - 25, 2016. Please visit our booth...
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12月, 2, 2015
tei Solutions to exhibit at SEMICON Japan 2015
tei Solutions will be exhibiting during SEMICON Japan 2015 at Tokyo Big Sight, December 16 - 18, 2015. Please visit our booth, located in East Hall 5, Booth#5202 to learn more ab...
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9月, 3, 2014
New 300mm Patterned Wafer Available
tei Solutions has added new 300mm Patterned Test Wafers: Si L/S Etch – Line=50nm, Depth=1000nm Si Hole Etch – φ120nm, Depth=1200nm SiO L/S Etch – Space=120nm, Depth=2700nm Nano gap...
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