tei Solutions provides innovators and developers the ability to utilize process engineers - each with over 15 years of experience in the semiconductor industry and each with a wide breadth of expertise. Process Engineering Capabilities:
  • Anneal
  • CMP
  • CVD
  • Dry Etch / Plasma Etch
  • Ion Implantation
  • Lithography
  • Oxidation
  • PVD
  • Wet Cleans